Used HAMAI 9BF #9166536 for sale

HAMAI 9BF Wafer Grinding, Lapping & Polishing equipment is a semi-automatic system designed for the grinding, lapping and polishing of semiconductor wafer materials. This unit is capable of performing grinding or lapping operations over a wide range of material surfaces, from DAF (>10FF) to ultra-smooth (<1FF). 9BF is an easy-to-use, economical machine that eliminates or significantly reduces manual grinding, lapping and polishing steps in the production of semiconductor wafers. The tool consists of three main components: the Rotronic HAMAI 9BF components, an external agitator and an interchangeable crystallization material kit. 9BF Rotronic components include a workholder, a precision motor, a High Precision Chuck, and an Opto Bedding Asset to adjust the chuck speed and vertical lifting during the grinding and polishing process. The Opto Bedding Model also allows for easy switchover to manual operation in case of emergency or when a manual grind is required. The external agitator is used to hold and spin the sealed material kits during the grinding or lapping process. This ensures a uniform application of the grinding and lapping material onto the wafer surface, eliminating air voids and improving polishing results. The material kits are interchangeable for different applications. HAMAI 9BF equipment is designed for batch processing, with a single setup taking up to 30 minutes to complete. The system works with up to 50 wafers on a single set-up and can perform grinding, lapping and polishing operations simultaneously. The precision motor allows for uniform wafer rotation, and the adjustable chuck speed ensures uniform grinding/lapping and polishing as the material kit is applied. Operator control is minimal, thanks to the user-friendly touch screen display and dedicated controls, minimizing manual adjustment of the various parameters. The grinding/lapping operation is easily adjustable, from very rough flatness to ultra-smooth flatness, by changing the material kit. This versatility allows 9BF to process a wide range of materials, including wide variety of substrates and wafers. The unit can process materials over a wide range of areas, from narrow trenches to liquid damag domains. Once complete, the grinded/lapped material can be polished to a mirror-like finish while maintaining a low surface roughness. Subsequently, polished wafers can be transferred to further processing steps for wafer fabrication, or be used in applications such as Device Manufacturing, LCD and OLED Manufacturing, and Photovoltaic Cell Production. In summary, HAMAI 9BF Wafer Grinding, Lapping & Polishing Machine is a semi-automatic tool designed for processing semiconductor wafers. The precision motor ensures uniform grinding, lapping and polishing while the interchangeable material kits provide flexibility for different application requirements. Its user-friendly touch screen and dedicated controls minimize manual adjustments, making the asset ideal for high volume production.