Used HAMAI 9BF #9166541 for sale

HAMAI 9BF is a state of the art wafer grinding, lapping and polishing equipment. This precise and efficient system combines the best of both worlds - a high quality finish, polishing accuracy and cost savings. 9BF is a fully automated unit, consisting of a robotic loader, grinding/lapping/polishing (GLP) modules, belt drivers, stone trays and slurry circulators. The robotic loader precisely assembles and feeds the wafers to the precise grinding/lapping/polishing modules. The GLP modules use high surface speed diamond abrasive belts to grind, lap and polish wafers quickly and accurately. The fine particles generated by the GLP modules are collected using a closed slurry circulator and filtered from the residual debris on the belts. The cyclic air pressure that drives the stones ensures that debris is completely removed before re-lapping starts. The robotic loader is capable of loading up to 500 wafers in as short a time as possible. The special drive machine ensures that the robotic loader remains accurate, even when the wafer size or shape varies. The special drive ratio also minimizes noise and vibration, making the grinding/lapping/polishing process more efficient and quieter. The belt drivers ensure that the GLP modules work consistently and accurately. The stone trays provide the perfect environment for the polishing/lapping/cutting stones to remain in perfect shape even after a long day of grinding, lapping and polishing wafers. The high volume flow rate of HAMAI 9BF ensures that the slurry circulator collects all the debris and particles left behind after the grinding, lapping and polishing process. Overall, 9BF is an ideal tool for efficiently polishing wafers of any size or shape. The combination of the robotic loader, GLP modules, belt drivers, stone trays and slurry circulator, and the review asset make it possible to polish wafers with both accuracy and speed, while saving costs over traditional grinding, lapping and polishing techniques.