Used HAMAI 9BN-3M5P #9007421 for sale

HAMAI 9BN-3M5P is a multifunctional wafer grinding, lapping, and polishing system, designed to concurrently perform high-tolerance grinding, lapping, and polishing of wafers up to 450 millimeters in diameter. This industrial-grade system is capable of providing an exemplary surface finish and extraordinary surface flatness with its adjustable control mechanism and precision levels. 9BN-3M5P's Wafer Grinding Function features a carefully-designed grinding wheel that utilizes latest technologies and advanced materials, offering high flexibility and removing silicon, glass, and other soft materials in a single step. It can also be precisely adjusted to any desired grinding condition and customized to suit specific requirements. The system maintains a low temperature level while grinding and offers a wide array of grindable materials. It also comes with an adjustable workhead that provides a full range of grinding speeds. HAMAI 9BN-3M5P's Wafer Lapping Function is equipped with a precisely-engineered lapping plate that ensures a high degree of accuracy and uniformity. It is also engineered for rapid cutting action, reducing lapping and polishing time by up to 30%. This reduces tooling costs and increases wafer's performance and overall production throughput. The lapping function also includes adjustable lap forces, allowing higher precision and lower abrasion times. Finally, 9BN-3M5P's Wafer Polishing Function utilizes its inbuilt variable frequency drives for efficient control over the polish process. Its exceptional high-torque precision-driven motors result in superior surface finish and uniformity. This allows the operator to precisely adjust the polishing force from the touch panel, achieving higher levels of accuracy. HAMAI 9BN-3M5P represents the merger of advanced technologies and over a decade of experience in the semiconductor industry, designed to provide excellent results for any wafer grinding, lapping, and polishing process. Its efficient and precise construction makes it a reliable and durable tool for any wafer finishing requirements.