Used HAMAI SC20B-4M-5P-1P #9273234 for sale

HAMAI SC20B-4M-5P-1P is a wafer grinding, lapping & polishing equipment used for semiconductor wafer fabrication. This system is suitable for production of high quality wafers in both, single sided and two sided processes. The unit is constructed using a powerful drive control and features a four motor configuration which provides precise control and efficient delivery of power to each individual stage. The machine is equipped with a wafer stage which can perform multiple, simultaneous grinding and lapping operations. This allows for greater control during the processing of a range of different wafer formats and sizes. The tool also features a grinding spindle with variable speed, adjustable for each grinding operation. This ensures that the end product is of a desired quality and finish. SC20B-4M-5P-1P also includes a precision polishing head, which offers a precise and uniform contact pressure across the whole wafer surface. This head is complemented with a fast spindle which ensures a highly accurate finishing of the wafer surface. HAMAI SC20B-4M-5P-1P also offers advanced, programmable control asset which simplifies the operation of the model and offers customisable settings for each process. This allows for higher throughput and greater process accuracy in each stage. The equipment also provides for a high level of quality assurance, featuring a system for dust and particle removal, which ensures a clean working environment and further improves the quality of the end product. In conclusion, SC20B-4M-5P-1P is a highly capable wafer grinding, lapping & polishing unit suitable for a wide variety of applications. It combines advanced technology, reliable performance and superior precision in order to provide a superior level of quality at a production scale.