Used HANYANG HY-P/C #9378334 for sale

HANYANG HY-P/C is a wafer grinding, lapping, and polishing equipment designed to produce extremely flat surfaces on wafers for use in the semiconductor industry. This system is capable of processing a variety of wafer materials, including silicon, gallium arsenide, and aluminum nitride, to name a few. The unit is built with a robust frame that ensures precise results while achieving tight tolerances. HANYANG HY-P/C is equipped with a variety of features for superior grinding, lapping, and polishing performance. The machine is composed of two distinct and separate stations: an adjustable spindle station and a fixed-position platen station. This combination of spindle and platen provides greater flexibility in creating customized configurations to achieve higher production throughput. Additionally, the tool is equipped with a powerful motor with speed control, allowing precise process control and process repeatability. The asset is also capable of metering the correct amount of grinding process abrasive and grinding media. The adjustable spindle station uses a special tool arm and head assembly to move the grinding wheel axially and radially across the wafer surface. Additionally, various adjustable parameters will allow tailoring of the grinding process. These parameters include spindle speed, feed rate, and abrasive application rate. This allows for precision grinding of large wafer surfaces. The platen station contains a motorized XYZ table that is adjustable and includes a dynamic headstock and tailstock that work together to hold the wafer in position during processing. This ensures a consistent and repeatable grind each and every time. The adjustable platen has an adjustable Z axis to control the depth of the grinding process. Finally, the lapping and polishing station uses diamondtooling to finish the surface of the wafer to desired specifications. The diamond tooling is applied via a lap holder and the lap is pushed against the wafer's rotating table to achieve a highly polished finish. To sum up, HANYANG HY-P/C model is a robust and high precision wafer grinding, lapping, and polishing equipment with the ability to process a wide range of wafer materials while ensuring repeatable process results and production throughput.