Used HARIG 612 #9390527 for sale

HARIG 612 is a wafer grinding, lapping and polishing equipment designed for surface flatness, thickness variations and surface, corner, and edge quality polish. It is an all-in-one wafer finish system specifically designed for producing precision-finished wafers for the semiconductor industry. 612 unit includes two main components: a precision wafer grinder and a rotary polishing arm attachment. The wafer grinder consists of a motorized spindle base and a 12-inch diameter platen, which is driven by a heavy-duty precision spindle motor connected to a digital control machine. The platen's surface is adjustable for process control, and its multiple layers of filter paper keep particles from contaminating the surrounding environment. The grinder also has a built-in air filter and exhaust fan to vent off any heated air generated by the grinding process. The rotary polishing arm is built with precision optics for controlling depth of the wafer, and it includes an anti-static dial to adjust the polishing speed. The arm carries a 600-grit diamond wheel for lapping and grinding, which runs at a rotation speed of up to 300 rpm. The diamond wheel is sealed to prevent dust from entering the grinding chamber. The arm is also fitted with a vacuum to suck away abrasive particles from the face of the wafer, and a light emitting diode to check the wafer's thickness and surface patterns. Once a thin uniform grinding and lapping layer is achieved, the wafer is ready for polishing. HARIG 612 uses a soft polishing tool that uses a combination of compressed air, colloidal silica, and deionized water to achieve an exact finish. The soft polishing asset uses a combination of low pressure air, colloidal silica, and deionized water to polish large and difficult to reach surfaces. A built-in air filter and exhaust model also help protect the environment by venting off any heated air generated by the polishing process. Finally, the polishing process can be further improved by adding a spin-coater to the machine. The spin-coater provides an even coverage of the polishing material on the wafer, allowing for increased consistency and polish uniformity. 612 equipment provides a fast, reliable and consistent way to finish a wafer and guarantee top-notch quality control. The machine is versatile, user-friendly and easy to operate, while providing a high-level of cleanliness for a dust and particle-free working environment.