Used HARIG 618 #293656113 for sale

HARIG 618 is a wafer grinding, lapping and polishing equipment utilized primarily in the semiconductor industry to upgrade and optimize substrates. The system is designed to produce high quality precision surfaces on substrates ranging from two to twelve inches in diameter. The core of 618 unit is the belt drive grinding platform that consists of front and rear drive rollers, an adjustable platen, abrasive belt(s) of user-selected widths and grits, and adjustable pneumatic support machine. The tool is designed for flexibility with regards to various applications by offering two interchangeable adjustable platens; a 20" flat platen and a 13" conical platen for tapering of substrates. A digital Controller Unit adds further flexibility and customization for accurate abrasive belt rotation speeds, belt alignment, and platen handling. The front and rear drive rollers are included to promote consistent tension on the abrasive belts, reducing chipping, vibration, and achieving a superior quality finish. The adjustable platen is capable of precise angular control to aid in the process of grinding convex and concave ceramic fragments, such as wafers and caps. The pneumatic support asset adds stability and allows for grinding on large substrates up to twelve inches in diameter. When connected to dust extraction systems, HARIG 618 eliminates dust and grinding residue for a cleaner working environment. A built-in stationary chuck pin table offers stability during lapping and polishing processes in conjunction with suitable circulation, Dressing, and Deburring wheels.The adjustable holder removes substrates from the chuck and allows for precise force to be applied on the pin table for optimal polishing processes. 618 is an all-in-one wafer grinding, lapping and polishing machine allowing users to clean, grind, lap and polish nearly any germanium, gallium or ceramic substrate up to twelve inches in diameter. With its adjustable platen and abrasive belt widths, users can customize the machine for various grinding and polishing processes. Furthermore, the dust extraction model provides a dust-free working environment, while the pin table and adjustable holder improve the accuracy of lap and polishing processes. HARIG 618 is a reliable, efficient and high-tech equipment for grinding, lapping, and polishing of semiconductor substrates, allowing users to optimize wafer size, shape, and flatness specification for maximum efficiency and quality.