Used HARIG 618 #9208309 for sale

HARIG 618 Wafer Grinding, Lapping & Polishing Equipment houses an oversized high-precision ceramic-coated grinding spindle that is capable of grinding, lapping and polishing a wide variety of materials. The system can work with wafers up to 6-inches in diameter with a standard spindle speed of 200,000 rpm. A range of grinding and polishing solutions are available for 618 unit, including single point diamond/boride, polycrystalline diamond, and abrasive/polishing rolls. The machine can easily be interfaced with a variety of manual and automated programming methods in order to meet customer requirements. Each drum has a maximum speed of up to 3600 rpm and features adjustable grinding pressure and variable speed control. HARIG 618 Wafer Grinding, Lapping & Polishing Tool is constructed from heavy-duty, non-corrosive materials to ensure maximum output and longevity. All components are designed to be low maintenance and long-lasting, eliminating the need for frequent part replacement. The, fully enclosed, safety-interlocked chamber enables users to access the asset without needing to shut it down, while at the same time ensuring the operator is shielded from high-velocity spindle noise and debris generated by the process. The model also incorporates a two-stage vacuum design to evacuate any airborne particles, thus ensuring a clean and safe working environment. 618 Wafer Grinding, Lapping & Polishing Equipment also offers a remote control unit and a PLC-controlled process monitoring feedback loop. Advanced safety and diagnostic features are provided via the easy-to-use operator terminal. The system can also be integrated into any networked manufacturing unit or data logging machine. In summary, HARIG 618 Wafer Grinding, Lapping & Polishing Tool is a powerful and adaptive asset that is capable of grinding, lapping and polishing a wide variety of materials in an efficient and safe manner. It is built to last with low maintenance and offers a range of advanced features for user convenience.