Used HARIG 618 #9265288 for sale

HARIG 618 Wafer Grinding, Lapping and Polishing Equipment is a precision piece of equipment for the grinding, lapping and polishing of wafers in a variety of materials. The system is designed to meet the needs of a wide range of industries, such as semiconductor manufacturing, optics and life sciences, for exacting quality control and accuracy. 618 employs a robust user-friendly design that includes a high-precision spindle and bed assembly, which is made from cast iron and is rigidly held in place. Additionally, the unit includes two independent drive motors, one for grinding and lapping, and one for polishing, allowing for complete control of the entire cycle. HARIG 618 machine features an advanced control tool that is designed to significantly reduce operation time and increase consistency. The software, combined with the intuitive user interface, easily allows an operator to program the asset for desired results. Furthermore, the controls allow for easy adjustment of rotation speed, grinding pressure, and polishing force, giving the operator complete control over the grinding process. 618 includes a full set of accessories and consumable components necessary to start a grinding, lapping or polishing job. The accessories include abrasive, dressing wheel, and polishing pad supplies. Additionally, HARIG 618 features a 6"x 30" turntable, which allows for wide area grinding and polishing, and a high-volume dust collector for debris separation and collection. The versatility and robust design of 618 ensures that the model is able to perform a wide range of functions effectively and accurately. Additionally, the equipment provides improved safety and ergonomics over traditional wafer grinding and processing systems, allowing for a higher quality of work. HARIG 618 is an ideal tool for those looking for cost-effective and reliable wafer grinding, lapping and polishing systems.