Used HARIG 618W #9114508 for sale

HARIG 618W is a wafer grinding, lapping & polishing equipment designed for the production of semiconductor wafers. It is a single-head wafer grinder which is capable of producing ultra-smooth surfaces with high accuracy, repeatability, and uniformity. The system is designed for precise grinding, lapping and polishing of silicon, gallium arsenide, and other semiconductor-grade materials. 618W is designed to provide a highly efficient, reliable, and versatile means of grinding a wide variety of semiconductor wafers. It features a 6-inch (150 mm) grinding wheel, a 2-axis crossfeed table, and a head movement unit. This powerful and robust machine allows for quick and easy wafer grinding, lapping, and polishing operations. The tool also incorporates advanced controls and software for intuitive operation and maximum programming flexibility. The 6-inch grinding wheel consists of multiple hard and open abrasive phases and is suitable for processing materials harder than 75 HV. The wheel is designed to produce the highest possible surface finish when grinding silicon, gallium arsenide, and other semiconductor-grade materials. The head movement asset ensures that the abrasive particles cut uniformly and evenly along the wafer's surface. The 2-axis crossfeed table allows for precise and repeatable grinding operations. The automated software incorporates advanced control algorithms which facilitate quick and easy operation. The process can be optimized to produce specific surface characteristics. The grinder is equipped with water cooling, dust extraction, light sensors, and vibration damping to ensure optimal performance in extreme environmental conditions. HARIG 618W is the perfect choice for customers looking for a reliable and cost-efficient wafer grinding, lapping, and polishing model for semiconductor wafers. Thanks to its advanced design and automated process control, the equipment can produce excellent results with minimal downtime, ensuring reliable and repeatable performance.