Used HARUCHIKA HPS-50 #9378348 for sale

HARUCHIKA HPS-50
ID: 9378348
Grinding and polishing machines.
HARUCHIKA HPS-50 is an advanced precision wafer grinding, lapping and polishing equipment used to produce high-quality optical coatings for various industrial and high-tech applications. The system is the first of its kind that can grind, lap and polish a wide range of wafers, from 0.3 to 6" (8 mm to 150 mm) in diameter. HPS-50 uses a precision membrane lapping process, which creates the desired optical coating without damaging the wafer's surface, resulting in a better finish and superior optical characteristics. The unit is built with a highly rigid and vibration-dampened frame, which allows for accurate and precise grinding, lapping and polishing processes. The machine is equipped with a highly efficient spindle motor, highly precise grinding and drive mechanisms, and a precise optical head movements, which enable an accurate cut of each wafer. A special optical lens adjusted to the grinding disc is used to focus the grinding forces onto the optical coating to eliminate grinding or polishing defects. The machine also includes a special electro-magnetic-clamping tool, which enables rapid and secure clamping and un-clamping of various wafer sizes. The asset is controlled by an embedded PC and industrial PLC and uses proprietary software to control the process. The software allows for automation of the grinding process, allowing for maximum repeatability and accuracy of the finishes. The model also offers a range of advanced safety features, such as automatic shut-off the equipment when malfunction occurs and automatic recovery of the system after power failure. HARUCHIKA HPS-50 is a reliable and cost-effective grinding, lapping and polishing unit used to manufacture high-quality optical coatings for various industrial and high-tech applications. It has a highly rigid and vibration-dampened frame, a precision optical head, an efficient spindle motor, and an electromagnetic-clamping machine, which enable an accurate cut of each wafer. The tool also offers a full range of advanced safety features, making it an ideal choice for precision optical coatings.
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