Used HAUSER S 40 #9052577 for sale

HAUSER S 40 is an advanced wafer grinding, lapping and polishing equipment with unparalleled flexibility, particularly suitable for high-precision and high-volume processing. The system is characterized by its maximum flexibility, outstanding surface quality and high output rate. With the use of integrated, diamond abrasive tools, S 40 can be used for the following grinding, lapping and polishing processes: Grinding: HAUSER S 40 utilizes an ultra-precise spindle, which is available in diameters of 40 and 50 mm. This ensures maximum stability for the grinding process and an optimal surface finish. In addition, integrated, diamond abrasive tools offer maximum flexibility and significantly improve grinding results. The highly-precise spindle also ensures accurate alignment of the tool on the wafer. Lapping: The aggressive lapping process of S 40 ensures a homogeneous surface texture, even on complex surfaces. The robust lapping process, combined with the high-power spindle, guarantees uniform surface levels. Polishing: HAUSER S 40 utilizes a robotic unit equipped with a variety of interchangeable polishing tools, which allow for any degree of polishing. The fully-automatic polishing process provides maximum flexibility and consistency by ensuring that the materials are polished to a very even surface finish. S 40 offers a fully automated, highly efficient and reliable process for grinding, lapping and polishing of wafers. The excellent surface quality and throughput rate makes it an ideal choice for the production of high-precision wafers. The machine is ideal for any application requiring maximum flexibility, accuracy and speed.