Used HEAVY SMOKER HVS-100 #293590870 for sale

HEAVY SMOKER HVS-100 is a wafer grinding, lapping and polishing equipment designed to provide precise polishing of semiconductor wafers up to 100mm in diameter. The system works by grinding and lapping two surfaces together in order to achieve an extremely flat surface finish with sub-micron and nanometer accuracy, ideal for applications such as semiconductor fabrication and electronic device manufacturing. The grinding, lapping, and polishing process begins with a wafer undergoing pre-grinding for optimum flatness and surface profile. This is achieved using an automated diamond grinding unit with an adjustable spindle speed and grinding pressure. A rotating diamond grinding wheel is typically used, which is capable of providing a wide range of grinding, lapping, and polishing capabilities. Once a surface has been ground to the desired flatness, it is time to move on to lapping and polishing. This is achieved by utilizing a precision lapping plate and diamond abrasive impregnated lap to reduce surface irregularities and smooth the wafer surface. The amount of lapping and polishing time required depends on the surface finish alignment requirements of the application. To ensure optimal results, various sub-micron diamond abrasives can be used throughout the entire process. HVS-100 also includes a programmable control machine that allows for an automated polishing process. This includes setting the processing recipe, controlling the spindle speed, as well as pressure and polishing time. This provides a consistent process and optimum flatness and surface finish alignment. This all-in-one tool is designed to provide exceptional results with high-precision applications and ultra-thin wafer polishing needs. HEAVY SMOKER HVS-100 provides fast and highly reliable wafer grinding, lapping and polishing with minimal manual intervention required. This asset is ideal for semiconductor fabrication, substrate fabrication, as well as a number of other precision applications.