Used HITECHNOTH HIT-128 #293616722 for sale

HITECHNOTH HIT-128 wafer grinding, lapping and polishing equipment is designed to provide efficient, cost effective processing of compound semiconductor materials. This system is ideal for high-volume production of thin wafers and lapping of complex shapes. HIT-128 utilizes a precision-controlled, stationary-abrasive polishing head which can be used to grind and polish both simple and complex shapes. With a rigid, vibration-free frame, the unit provides high production quality with repeatable results. HITECHNOTH HIT-128 is equipped with CNC motion control and a multi-axis grinding spindle to provide accurate and consistent grinding. The machine also includes an advanced process control software which provides for flexible process control, achievable grinding performance and data diagnostics. HIT-128 is also capable of grinding thin wafers down to a thickness of 10 microns, providing both high quality and high throughput performance. The tool's lapping/polishing head is designed to process fragile materials efficiently and safely, while providing repeatable results. With a modular, expandable design, the asset can be configured to meet specific customer requirements. HITECHNOTH HIT-128 is available in both standard and expanded configurations, allowing for increased flexibility and a wider range of processing capabilities. HIT-128 is ideal for use in high-volume production of compound semiconductor materials. It offers a high throughput rate with industry-leading accuracy and repeatability. The model's automated process control capabilities provide for efficient process optimized grinding/lapping and a consistent product. With its advanced abrasive technology and rigid frame, HITECHNOTH HIT-128 is an ideal choice for both simple and complex wafer grinding, lapping and polishing processes.