Used HITECHNOTH HIT-128 #293616725 for sale

HITECHNOTH HIT-128 is a state-of-the-art wafer grinding, lapping and polishing equipment which employs advanced technology for precise planarization of wafers. The system is designed for use in semiconductor fabrication processes and other industries where surface flatness is an important consideration. The advanced technologies used in HIT-128 unit include two-step polishing, high-speed wafer grinding, in-situ lapping and a unique magnetic polishing technique. The two-step polishing helps to ensure consistent planarization across the wafer substrate. The high-speed wafer grinding utilizes abrasives with uniform grains to remove surface defects and imperfections. This grinding process can be used effectively on both planar and non-planar substrates. The in-situ lapping process further refines the already planarized surface, leaving it even smoother and more efficient. Finally, the magnetic polishing technology helps to reduce any remaining surface imperfections and improve overall wafer planarization results. HITECHNOTH HIT-128 includes automatic wafer handling capabilities, allowing the user to move up to three wafers at a time with minimal operator intervention. Additionally, the highly efficient air-cooled spindle systems result in improved grinding efficiency and faster wafer handling. The machine can also be used with a variety of accessories, such as polishing compounds, diamond grinding cups and abrasive sheets, meaning it is well-suited to a variety of wafer grinding and polishing needs. Thanks to its durability and compact design, HIT-128 tool fits into any working environment. It is also highly reproducible, so it can produce consistent results over time, making it an ideal choice for any wafer grinding and planarization requirement. In short, HITECHNOTH HIT-128 asset is the perfect combination of advanced technologies and easy-to-use functionality, allowing users to achieve superior results with maximum efficiency.