Used HITECHNOTH HIT-18P-R2 #9143435 for sale

HITECHNOTH HIT-18P-R2 is a powerful wafer grinding, lapping and polishing equipment for single wafers or even multiple wafers up to 6" in diameter. It is specially designed for silicon and compound semiconductor wafer fabrication and is ideal for research and development environments. This wafer grinding system operates with two linear stages, which move the wafer back and forth along its own plane, for uniform, consistent surface quality. The unit's robust design allows for smooth motion and precise control over the distance traveled. The built-in software features a user-friendly touchscreen interface with various motion and process settings for each grinding and lapping phase. The unique sensors of the machine can be adjusted for tight tolerances and complex process control for the highest quality results. HIT-18P-R2 is also equipped with two 8" polishing heads. By optimizing the direction and speed of the polishing challenges, users can quickly achieve surface finishes down to Ra 0.1nm with fewer steps. The tool also features a powerful 3-axis control asset for dynamic removal rates and exceptional surface finish. With its high power brushless DC motors, this model offers much faster throughput and more accurate speeds. Made of stainless steel and aluminum, HITECHNOTH HIT-18P-R2 is a sturdy equipment that can handle challenging lapping and polishing tasks. Additionally, the system's automated process control and analyzer unit provides users with real-time data for quick adjustments. The machine also has an alarm and emergency stop feature for instant shutdown and maximum safety. HIT-18P-R2 is a reliable wafer grinding tool with superior grinding and polishing performance. With its two 8" polishing heads, efficient process control, robust design and comprehensive safety features, it is the best choice for precise wafer production.