Used HITECHNOTH HIT-18PW #9257659 for sale

HITECHNOTH HIT-18PW is an automated wafer grinding, lapping and polishing equipment designed for high performance, precision volume production grinding, lapping and polishing of large silicon and other semiconductor wafers. HIT-18PW features a PLC/HMI control system which allows the operator to select various grinding, lapping and polishing operations from its simple-to-use touchscreen interface. The unit is equipped with positive grinding pressure thru the rotating disc which maintains a controlled force during the grinding process. This force is applied by adjustable hand-wheel. HITECHNOTH HIT-18PW further features a three CNC axes tilt head machine designed for simultaneous plunge grinding, tilt grinding and peripheral grinding. The tilt head mechanism automatically adjusts to required angles and maintains maximum grinding stability during the entire grinding process. The lapping section of the tool features a volumetric controlled metering device which continuously controls the amount of abrasive and lubrication fluids on the face of the wafer, enabling optimized lapping and polishing results with minimal losses. The lapping and polishing chamber is a statically and dynamically balanced for precise roundness and concentricity. HIT-18PW also features a two-stage cooling substation and dynamic compressors which cools the abrasive particles and lubrication fluids. This ensures that the grinding, lapping and polishing process is conducted in a temperature-controlled environment. The microprocessor in HITECHNOTH HIT-18PW is equipped with an integrated programmable logic circuit and is used to collect and analyze data from the grinding, lapping and polishing operations, enabling the operator to track the progression of the process and precise results. To ensure the best results, a CCD camera is used to detect wafer position and inspect the wafer surfaces before, during and after the lapping and polishing operations. Finally, the asset is equipped with a dust and fume extraction model which collects airborne particles generated in the grinding, lapping and polishing process. The collected particles are then deposited in the automated dust collection unit. Overall, HIT-18PW is an automated and high performance equipment which provides the user with the quality and results required for precision volume production grinding, lapping and polishing of large silicon and other semiconductor wafers.