Used HITECHNOTH HIT-18PW #9273838 for sale

HITECHNOTH HIT-18PW is an advanced wafer grinding, lapping & polishing equipment for precision applications. It is designed to provide exceptional surface quality and reliability with an accuracy of up to 1 μm. This system is suitable for processing various types of materials such as Silicon, Quartz, InP, GaAs, and other highly sensitive materials. HIT-18PW features a sturdy rigid construction to reduce vibrations and ensure precise alignment. It is designed with a large working chamber measuring 8.46 X 18.9 inches (215 X 480 mm). It is also equipped with a powerful four-pole brushless dc motor that provides reliable speed control and increased longevity. HITECHNOTH HIT-18PW can process wafers up to 8" diameter and is equipped with an in-chamber cooling fan and an independent cooling fan. The unit is also equipped with a control panel to monitor the grinding, lapping, and polishing processes. The control panel also enables the user to set the grinding process parameters such as dwell time, pressure, speed, and number of laps. The lapping & polishing stages are supported by a diamond-coated lap plate that can be fully adjusted for accuracy. The machine is also designed to be compliant with modern safety regulations with a low-voltage power supply and integral contact protection. HIT-18PW features a user-friendly touch-screen control which offers a wide range of programming abilities. This includes information display, monitoring, and control of the grinding and lapping parameters. The tool comes with two grinding/polishing trays: one for grinding as well as one for polishing. It is also designed to be fully automated with a software that allows for easy customization of the lapping & polishing process. HITECHNOTH HIT-18PW is equipped with two separate inverters to enable improved accuracy for both the grinding and polishing processes. It is also designed with the ability to monitor the asset's temperature and allow for adjustment as necessary. Overall, HIT-18PW is a powerful, sophisticated, and user-friendly wafer grinding, lapping & polishing model with a range of applications. With its robust construction and accurate, repeatable results, it is suitable for use in precision applications. The equipment's combination of easy-to-use programming abilities, automated processes, and independent cooling fans ensure the user has a wide range of options when working with this system.