Used HITECHNOTH HIT-24PS #9208753 for sale

HITECHNOTH HIT-24PS
ID: 9208753
Vintage: 2004
CMP System 2004 vintage.
HITECHNOTH HIT-24PS is a wafer grinding, lapping & polishing equipment designed to provide high accuracy and quality surface finishes on wafers, MEMS, semiconductors, and other complicated geometries. This system has been designed and developed to meet the needs of today's advanced technologies and features the highest level of precision available in the industry. HIT-24PS unit utilizes a variety of grinding, lapping and polishing techniques to achieve the required surface finishes with extremely high accuracy and repeatability. This machine is capable of performing grinding and lapping of surfaces to a minimum of 10 μm RMS or higher and can achieve polishing to 1 μm in an as-received condition. It includes components such as advanced rotary lap plates, a platen assembly, and a CNC-controlled wafer grinding table with a programmed feedrate capability. Additionally, this tool is equipped with several automation and optical inspection features for improved user efficiency and quality assurance. This asset offers wafer grinding, lapping and polishing capability for various surfaces, ranging from flat to highly complex geometries. The innovative design enables the user to perform wafer grinding, lapping and polishing operations all in the same model with no need for separate machines or tools. HITECHNOTH HIT-24PS equipment offers a user-friendly software interface for an easy and efficient operation. By entering a few key parameters such as the size of the wafer, required surface roughness, and process duration, the system determines the optimum grinding, lapping and polishing parameters and processes the wafer without any manual intervention. The unique design of HIT-24PS wafer grinding, lapping & polishing unit ensures that the surface finish levels achieved are consistently high and the wafer is free of any defects or contamination. This machine provides excellent process reproducibility with low wear on parts, enabling it to meet the wafer processing demands of today's most advanced industries. Additionally, the tool features diagnostic capabilities to detect any types of faults and alert the user, enabling high-quality results. Overall, HITECHNOTH HIT-24PS is an advanced wafer grinding, lapping & polishing asset with extreme accuracy and reproducibility. It is designed to meet the tightest process requirements and provide the required surface finishes with utmost consistency and precision. This model is well-suited for a wide variety of applications, including but not limited to MEMS, semiconductors, and other complex geometries.
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