Used HITECHNOTH HIT-32P-RP3 #9143383 for sale

HITECHNOTH HIT-32P-RP3 is a multi-functional wafer grinding, lapping and polishing equipment. It provides an efficient solution to processing surface wafers in a controlled and clean environment. The system is designed with 3 independently controlled user-programmable spindles that allow for flexible machining of wafers between 5nm and 3 mm thick. It has a full working area of 250 mm x 300 mm x 80 mm for wafer grinding, lapping and polishing. With its powerful and easy to use regrinding software, it is an ideal choice for both research and production applications. HIT-32P-RP3 continues to provide power and precision with a 25HP motor that drives the spindle at a speed of up to 12,000 rpm. The unit also features a powerful vacuum machine that ensures safe and reliable collection of metal particles, allowing a safe working environment. The tool is also designed with a PLC controller which offers a fully automated operation. With 24-bit precision, the asset continuously monitors process parameters to ensure consistent results without the need for any manual intervention. HITECHNOTH HIT-32P-RP3 also offers a number of dry grinding options which allow for increased process flexibility. By using ceramic or diamond abrasive discs, operations such as taper polishing and grinding can be carried out with ease. The model provides excellent repeatability and good surface finish with a minimum variation of less than 0.1 μm. In addition, HIT-32P-RP3 is equipped with a quick release equipment which allows for easy and safe tool changing. This system prevents the risk of any contamination from lubricants and prevents the need for periodic maintenance. The unit is also designed with an integrated machine for monitoring both temperature and pressure which ensures conditions are always appropriate for the type of work being carried out. HITECHNOTH HIT-32P-RP3 is designed to achieve the tightest tolerances in the industry and can provide both high accuracy and high throughput with excellent repeatability. It is a reliable and high-performance tool offering precision, repeatability and accuracy for wafer grinding, lapping and polishing, making it an ideal choice for both research and production applications.