Used HITECHNOTH HIT-32P-RP3 #9257654 for sale

HITECHNOTH HIT-32P-RP3
ID: 9257654
Vintage: 2008
Single side polisher 2008 vintage.
HITECHNOTH HIT-32P-RP3 is a fully automated wafer grinding, lapping and polishing equipment. It has been designed to meet the requirements of a variety of applications, including semiconductor, different optical devices, and miniature electronic components. This grinding and polishing system has the capability to produce flawless semiconductor wafers with uniform surface features in single pass. It utilizes advanced technologies, such as motor torque control and advanced vacuum systems, to achieve high degree accuracy and precision in processing. HIT-32P-RP3 consists of a CNC lathe-style main base unit, several robotic arms, and several precision grinding/polishing tools. The lathe base features a work table where wafers can be loaded. The robotic arms are able to move the wafers into the right positions for grinding and polishing. The precision grinding/polishing tools are equipped with high speed spindles with variable speed control, allowing for easy adjustment of the grinding/polishing parameters. The unit also incorporates several safety features, such as an emergency brake machine and automatic monitoring of all the related machines and tools. This ensures smooth and safe operation of the tool. HITECHNOTH HIT-32P-RP3 is designed for high efficiency and low operating cost. It is equipped with a low power consumption drive asset that requires minimal energy to maintain operation of the machine. The model also features a fully automated wafer feeding equipment that minimizes human intervention during operation. The system also features user friendly software which allows for easy and intuitive operation, as well as for programming complex tasks. All the necessary parameters controlling both the grinding/polishing process and the safety procedures can be easily programmed and recalled. Overall, HIT-32P-RP3 provides an efficient, reliable and affordable solution for complex wafer grinding, lapping and polishing. It is robust, compact and easily adaptable to different applications. This unit is an excellent choice for those companies or individuals looking for professional quality grinding, lapping and polishing with minimal hassle.
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