Used HITECHNOTH HIT-36F0D-RP3 #9143384 for sale

HITECHNOTH HIT-36F0D-RP3 is a highly advanced wafer grinding, lapping, and polishing equipment designed to produce the highest quality output with the utmost efficiency. The system utilizes precision load force control and a powerful spindle unit to accurately and consistently grind and lap all kinds of wafers, in sizes ranging from as small as 50 nm up to large wafers of up to 120mm in diameter. The high rigidity of the framework provides a stable working environment, while a built-in safety guard offers maximum protection for both operator and wafers. HIT-36F0D-RP3 features an advanced CCD alignment machine for precise positioning of the wafers, allowing for high precision grinding, lapping, and polishing in a gzipped edge-woolled structure. This aim of this structure is to minimize damage on the wafer edges and to provide the most optimal and uniform surface quality. The tool utilizes a specially designed spindle that can achieve up to 40,000RPM for exceptional grinding and polishing performance. The advanced motor drive asset offers echo-free, high-frequency operation with consistent motion control and grinding accuracy. An integrated automatic speed control further ensures smoother and faster operation. The fully enclosed model also provides a safe and dust-free environment for the operator, with a built-in liquids reservoir for the water equipment and a sloped bottom plate design allowing for easy drainage and cleaning. The system also incorporates several other safety features such as an emergency stop button, rotating chuck with soft lock mechanism, and countersunk locking screws. An integrated power monitor ensures the unit is always running at maximum efficiency, while three level laser alignment allows for greater accuracy and repeatability of the wafer grinding, lapping, and polishing process. The machine also features a flat surface detection tool that can compensate for errors and variations in surface flatness, ensuring optimal results. It includes an intuitive touchscreen interface and the capability to save profiles and settings between runs, allowing for enhanced productivity and accuracy. In short, HITECHNOTH HIT-36F0D-RP3 is an advanced wafer grinding, lapping, and polishing asset that provides high-precision results, safe operation, and reduced costs. With its innovative features and powerful spindle design, the model promises optimal performance and maximum return on investment.