Used HOFFMAN 66T #9232419 for sale

HOFFMAN 66T is a state-of-the-art wafer grinding, lapping and polishing machine that provides the highest level of precision and accuracy. Its premier automation capabilities are ideal for a range of applications such as: semiconductor packaging, optics and electronics, and medical and pharmaceutical devices. The machine incorporates a patented grinding disc and planetary grinding heads that provide superior cutting power and an ideal surface finish. With even pressure on the surface, this ensures uniform smooth surface across all wafer after lapping and polishing processes. The result is higher throughput with greater accuracy and precision in the finished product. 66T's advanced planetary driving system enables a flexible range of motion to precisely reach tight corners without having to manually reposition the disc. This reduces tedious setup times and improves quality consistency. To provide greater efficiency, the machine utilizes two modes: a precision mode that uses precise motor control and a speed mode that uses constant high speed. This allows the machine to efficiently finish jobs that require both high speed and accuracy. The machine's control panel is intuitive with a 7" LCD touch screen for easy programming. To further maximize the machine's speed and accuracy, the machine has 6 different grinding discs available, each specially designed to perform various operations from roughing out to lapping and initial polishing as well as to finer polishing. It also offers a host of other user-friendly features, such as level monitoring, that can be easily programmed from the control panel. Finally, HOFFMAN 66T is a highly durable machine with a long working life that can quickly and accurately produce a quality finish in both small and large production runs. This makes it an ideal choice for any manufacturing lab needing high-precision lapping, grinding or polishing.