Used HOFFMAN AOS145 #293602562 for sale

HOFFMAN AOS145 is a wafer grinding, lapping & polishing equipment that is widely used in the semiconductor industry. The system is equipped with an array of features that ensure an efficient and cost-effective performance. The unit features a high-performance air spindle design, with a maximum speed of 200,000 rpm. The spindle is capable of producing close-tolerance surface finishes, as well as a wide range of grinding and polishing operations. The machine also features a built-in contamination control tool, which ensures that the wafer's surface is free of contamination. The asset is capable of processing a variety of wafer sizes and shapes, with a maximum of 8 inch-dia wafers being supported. The model is equipped with a variable-speed support arm, which is capable of handling wafers from small-scale to large-scale. The equipment comes with a high-tech software interface, which allows for user-friendly operation. This software package enables users to program their desired parameters and automatically run the grinding, lapping & polishing operations. It also allows for data logging, allowing users to view and analyze their process data. AOS145 is designed for use in a wide range of semiconductor processes, such as wafer shaping, wafer bonding, wafer back grinding, wafer etching, wafer polishing, wafer gridning and wafer lapping. It is capable of producing high-quality results with minimal defects. Additionally, it is capable of achieving both rough and smooth finish of the wafer surface. HOFFMAN AOS145 is an efficient and reliable wafer grinding, lapping & polishing system. It is highly recommended for any semiconductor-related applications, as it provides both precision and cost-effective performance. The unit is excellent for achieving both rough and smooth surfaces on wafers, and its built-in controls ensure that the process is contamination-free.