Used HOFFMAN PR-1 66T #293626253 for sale

ID: 293626253
Lappers Plate lifts.
HOFFMAN PR-1 66T is a one-of-a-kind wafer grinding, lapping and polishing equipment that offers a high degree of automation and exceptional grinding, lapping and polishing capabilities. It is manufactured for the most precise and demanding applications, including the finest grade precision substrates and the most sophisticated device requirements. HOFFMAN PR-1-66T comprises of two main components - a central core and a processing chamber. The central core houses the fabrication of the central unit, with the main control room being located at the center and all the operational functions being provided from this part of the machine. The processing chamber consists of an enclosed chamber, where the actual grinding, lapping and polishing takes place. PR-1/ 66T is equipped with a high-quality DC servo-control motion system and digital servo-controllers, allowing it to achieve accurate and precise motion positioning and repeatability. This unit also provides a high-impulse torque drive machine, making it suitable for the most difficult grinding, lapping and polishing applications. HOFFMAN PR-1/ 66T is powered by an 8 kW AC motor, with an output speed adjustable to 6500 rpm and an impressive torque transfer of 5.5Nm. It is completely enclosed with a compressed air tight casing, reducing noise levels and providing the operator with improved protection and safety. PR-1 / 66T is fitted with a touch screen console, complete with Ethernet controls and high-resolution graphics. This allows for easy operation and a complete control over the grinding, lapping and polishing process, with the ability to carry out diagnostics as required. PR-1 66T has a wide range grinding, lapping and polishing tools and accessories to ensure maximum output according to the specific requirements of each application. These include a powerful mGO2 grinding tool, hard-durable pearl lapping stones, different diamond polishing wheels and even pattern lapping plates. HOFFMAN PR-1 / 66T is a world-class wafer grinding, lapping and polishing asset that offers a unique degree of adaptability and versatility to a wide range of applications. Thanks to its precise motion control and inputs, it delivers consistent accuracy and repeatability. Its spacious and ergonomically designed processing chamber ensures maximum productivity, efficiency and safety for the operator.
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