Used HOFFMAN PR-1 66T #293665070 for sale

HOFFMAN PR-1 66T Wafer Grinding, Lapping & Polishing Equipment is a specialized machine used for the precise grinding, lapping and polishing of wafers in the semiconductor industry. This system utilizes a rocker-arm style of grinding mechanism with diamond abrasive grit which is used to uniformly grind the wafers to a planar finish within the tight tolerances needed for the fabrication & manufacturing of semiconductor devices. The unit is composed of several components that operate together in precision to achieve the desired grinding, lapping and polishing process. At the heart of the machine is the polishing platen and holder or spider plate which holds the wafers in the proper orientation in the holder for the grinding and polishing processes. This is coupled with the main spindle that machined at the speed of 66 revolutions per minute and provides a uniform rotational movement for the grinding and polishing as the diamond abrasives are applied to the wafer. The tool is designed with a versatile speed control which allows for a slower speed to be used for the delicate grinding processes and a faster speed to be used for the lapping and polishing as the processes progress. This is coupled with the motorized tilting of the wafer holder as needed using the rocker arm style of grinding/polishing mechanism. This helps ensure a uniform finish to the wafers and helps minimize any potential damage due to increased friction or wear and tear of the substances being applied to the wafer. HOFFMAN PR-1-66T also comes with infeed and outfeed troughs to ensure that the entire wafer is covered over the entire range of the process while optimizing the cost of abrasives and time that it takes to complete the process. The clean linear outfeed from the asset moves the processed wafers out quickly, minimizing any potential cross contamination between various batches. In conclusion, the precision and reliability that PR-1/ 66T provides for the grinding, lapping and polishing of wafers sizes from 5" to 8" make it an ideal choice for semiconductor manufacturers. With its wide range of speeds and rocker arm grinding/polishing mechanism, it is capable of delivering high quality finishes on wafers quickly and efficiently. As a result, it allows semiconductor manufacturers to stay ahead in an ever competitive market.