Used HOFFMAN PR-1 66T #293792070 for sale

HOFFMAN PR-1 66T wafer grinding, lapping and polishing equipment is a precision wet process machine designed for producing high-quality, flat surface finishes and tight tolerance geometries on various materials including thin sections, silicon wafers, optical glass, fused silica, metals and plastics. The machine features precision spindles, which are capable of working at high speeds up to 120,000 RPM, while providing low vibration and ultra-silence. A joystick controller is used for precise control and offers a solution for all grinding, lapping and polishing processes. HOFFMAN PR-1-66T is equipped with a powerful and reliable direct drive motor that is capable of driving the main spindle at up to 10,000 RPM or the secondary spindle at up to 12,000 RPM. It also has two feed axles and a 3-axis automatic feed, which allows for fast loading and unloading of samples and components. The 3-axis feed can move up to 30 fingers per cycle with 0.1 microns repeatability. PR-1/ 66T offers fully automatic processes but also supports manual operation. The machine supports a variety of processes including grinding, slotting, polishing with single or double-sided slurry application, and single or double-sided finishing. It is also possible to use HOFFMAN PR-1 / 66T to fabricate a variety of components including optical lenses, mold inserts, and instrumentation components. The machine is equipped with a number of safety features, such as a programmable safety switch and an optional vision system. HOFFMAN PR-1/ 66T also has an advanced control unit which allows for easy monitoring and control of all the machine's parameters. It offers a wide range of data analysis capabilities including custom curve fitting and real-time plotting. The data can be used to adjust the machine's settings for optimal performance. PR-1 66T is a reliable and high-performance wafer grinding, lapping and polishing machine. It provides robust and precise results, while being very easy to use. It is suitable for both engineering and research and development applications and can be used for a wide variety of materials. The intuitive features make it an ideal choice for precision wet processing demands.