Used HOFFMAN PR-1 66T #293804192 for sale

HOFFMAN PR-1 66T is an advanced wafer grinding, lapping and polishing equipment for the semiconductor industry. It is designed to process semiconductor wafers or thin film disks up to 6-inch in diameter. The system contains various components like grinding wheels, lapping platens, polishing pads, and polishing solutions. HOFFMAN PR-1-66T unit has a movable bridge configuration that is ideal for high-volume wafer processing. The bridge machine provides maneuverability during the grinding and lapping processes. It has a maximum traverse speed of 0.47m/min and a maximum vertical speed of 0.35 m/min. The grinding wheels are equipped with a tiltable spindle that can be adjusted to different angles. The lapping platens and polishing pads also have a tiltable spindle that can be adjusted for precise positioning. The tool also comes with several different grinding, lapping, and polishing liquids. These fluids are designed to provide a clean and uniform finish on the wafer surface. The cleaning fluid helps to remove any residual contamination from the wafer surface before the polishing begins. In addition, the asset includes a built-in safety package that prevents overloading of the machine and other safety-related issues. PR-1/ 66T model provides a high level of automation for efficient and reliable processing. It offers a wide range of options for automated processes, such as automatic mode, programmed mode, and manual mode. The automatic mode can be used for basic processes including grinding, lapping, and polishing of the wafer. The programmed mode is used for more complex processes where the machine is able to program the grinding, lapping, and polishing parameters for each individual wafer. The manual mode allows for a manual operation of the machine's parameters. Overall, PR-1 66T is a powerful wafer grinding, lapping, and polishing equipment that is ideal for integrated circuits processing. Its movable bridge system provides precise positioning and adjustable confidence angles for better accuracy and control of the finishing process. Its versatile operation modes and various fluids make it a perfect choice for semiconductor and thin film wafer processing.