Used HOFFMAN PR-1 66T #9234491 for sale

HOFFMAN PR-1 66T is a versatile wafer grinding, lapping and polishing equipment that is designed to achieve the highest levels of precision and accuracy for wafer processing. The system offers a wide variety of features and capabilities to enable users to complete the most demanding wafer lapping and polishing tasks. The unit is constructed with a stainless steel housing and base, equipped with four interconnected components - grinding station, polishing station, lapping station and process chamber. The grinding station employs a high precision spindle motor that can grind wafers down to a thickness of 50 µm or lower. Additionally, the station is fitted with micrometer-driven loading and unloading mechanisms, as well as a motorized gravity feed machine, and a stationary rubber mat to hold the wafer in place. The polishing station is equipped with a high-torque polishing motor that is capable of providing a stable, low-vibration, and low-noise process. The station also features an automated cleaning tool that can be used to clean and rinse the polishing media in between processing. The lapping station includes an ultra-precision motor and turntable, as well as an automated control for adjusting the lapping parameters to ensure fine, uniform, and controllable polishing. It also includes an integrated belt cleaning asset and a slurry model to reduce the need for manual lapping and cleaning. The process chamber is equipped with unique technologies that ensure precise control of the process and a high-quality process result. It is a temperature-controlled environment with low levels of vibration and noise. It is also sealed to facilitate the use of an inert gas during processing. In conclusion, HOFFMAN PR-1-66T is a versatile wafer grinding, lapping and polishing equipment. It is designed to provide users with the highest accuracy and precision for all wafer processing tasks. The system is constructed of a durable stainless steel frame, along with four interconnected components with a range of advanced features. All of these components are designed to provide a stable, low-vibration, low-noise process, that can produce the most accurate and precise results for wafer processing.