Used HOFFMAN PR-1 66T #9251018 for sale

HOFFMAN PR-1 66T is a versatile and precision designed wafer grinding, lapping & polishing equipment. It features an advanced control system that can be used to regulate the grinding, lapping & polishing of the wafers. The unit is equipped with a high-performance grinding drive motor that can speed up and slow down the grinding process, allowing for precise control and accuracy. A multi-step lapping and polishing process guarantees a perfectly flat, true-to-spec wafer finish. HOFFMAN PR-1-66T is available with an optional c-frame configuration that enables improved automation of wafer grinding, lapping & polishing tasks. This feature allows for uninterrupted, productive operation and efficient handling of multiple wafers. The machine is designed to meet the needs of precision wafer handling and process control. It has an accurate and repeatable wafer surface finish and is designed for maximum production throughput. The tool can handle a variety of grinding & lapping processes, as well as polishing both hard and soft materials. It features a range of grinding, lapping & polishing tools and accessories to ensure the perfect result every time. It also boasts a high-end filtration asset for the ultimate cleanliness of wafers. PR-1/ 66T is a highly reliable and robust model capable of operating at high speeds. It has a solid construction for maximum reliability, and an advanced control equipment for precise and consistent grinding & lapping performance. The optional c-frame configuration allows for easy and efficient loading and unloading of wafers. The system is also quick and easy to set up and requires minimal maintenance. In short, PR-1-66T is a modern, precision designed wafer grinding, lapping & polishing unit that is designed to provide exceptional performance and results. The machine's flexibility and multi-step process make it an ideal choice for all wafer handling and processing needs.