Used HOFFMAN PR-1 #293822979 for sale

HOFFMAN PR-1 is a high-precision, heavy-duty grinding and polishing equipment designed for use on semiconductor silicon, compound, and compound-on-insulator (COI) wafers. The system is capable of producing industry-standard grinds and polish such as low-K (K value below 1.3 K Ω/V), electroconductive, and advanced diamond polish. The electrical characteristics and surface profiles produced by HOFFMAN PR1 are also quite suitable for lithography processes. The heart of PR-1 unit is a three-stage process allowing accurate control, automation, and uniform grinding and polishing. This process consists of two grinding stages and one polishing stage, with each stage having separate grind parameters so that the desired grades of process finish can be achieved. The first stage of grinding involves the use of a diamond wire saw or grinding wheel. This stage is used for rough grinding and defines the overall shape of the wafer. The diamond wire saw is capable of producing any surface profile depth required by the application, from 0.1 mm to 1 mm. The second stage of grinding involves the use of a fixed grinding wheel or polisher. This stage is used for fine-tuning the surface finish. The use of the fixed grinding wheel or polisher allows for the modulation of micro-profile irregularities, particle sizes, and surface roughness, particularly when trying to achieve complicated processes. The last stage of the process is a polishing stage. In this stage, the wafer is sprayed with a slurry of either silicone or diamond particles while being gently moved in an orbital pattern. This polishing stage is designed to smooth out the surface of the wafer to achieve a high-accuracy flatness. PR1 is an ideal machine for a wide range of wafer grinding, lapping, and polishing applications. It provides users with the ability to control profile accuracy, surface roughness, and finished wafer electrical characteristics. The tool is ideal for use in semiconductor wafer manufacturing and other research fields such as advanced lithography.