Used HOFFMAN PR-1 #293826077 for sale

HOFFMAN PR-1 is a versatile wafer grinding, lapping and polishing equipment designed to meet the demands of advanced thin-film processing. The unit offers a range of high-precision capabilities, providing excellent surface finish and shape control on standard or custom substrates. It is well-suited for producing wafers with optimum surface characteristics for use in a wide range of precision optical, magnetic, or electro-mechanical applications. HOFFMAN PR1 features an integrated, high-precision, six-axis robotic arm for exact wafer handling and polishing. The robot-held precision grinding wheel ensures maximum cutting and surfacing accuracy. The wheel can be specifically tuned to achieve consistent cutting action. It is capable of grinding, lapping and polishing substrates up to two meters in diameter. PR-1 also offers improved safety, thanks to its ultra-quiet operation and well-sealed system. The wafer can be processed in a non-abrasive environment, eliminating the risk of damage or contamination. The robot is also equipped with an array of sensors to detect and avoid contact with the wafer and other surfaces. PR1 also offers unmatched flexibility with its advanced process control software. Once setup is complete, users have complete control over the process. A wide range of parameters can be specified, allowing users to customise specific steps of the process. Programming can be done from any PC connected to the unit, giving users the ability to adjust parameters even while the process is in progress. The machine is also equipped with mechatronic components for rapid wafer loading and unloading. It utilises a patented network-based tool to ensure maximum performance, regardless of the number of wafers processed. The asset is modular design, making it easy to upgrade. Overall, HOFFMAN PR-1 is an ideal solution for advanced thin-film processing. It is designed to meet the specialised needs of precision optics, magnetic, and electro-mechanical applications. It offers users incredible versatility, thanks to its advanced process control software and mechatronic components. It also has a number of safety features to protect against damage and contamination. This makes it an ideal choice for any high-precision wafer grinding, lapping and polishing requirements.