Used ICHI SEIKI MDV 30 #9390284 for sale

ICHI SEIKI MDV 30 is a wafer grinding, lapping and polishing equipment that is designed to produce the highest quality, high-precision surfaces on a variety of materials such as Si, GaAs, and other materials used in the microelectronics industry. The machine is equipped with a fully automatic and programmable wafer carrier system for tighter, more consistent flatness control. MDV 30 features a step-controlled lapping/polishing head which can grind and polish simultaneously and with a one-step process. The unit is capable of holding parts to the micron level of accuracy in either horizontal or vertical axis. Grinding is accomplished using highly precise diamond wheels, allowing ICHI SEIKI MDV 30 to achieve surface roughnesses down to less than 0.3 μm. The built-in software also provides an easy user interface for setting and changing grinding parameters. With the control unit the operator adjust the table speed, feed rates, pressure, and possible rotation of the grinding wheel. The machine can also be used with different lapping abrasives. For lapping and polishing, MDV 30 utilizes a non-contact single face lapping/polishing plate. This machine is designed and built to ensure a high degree of accuracy and consistency in specimen preparation. ICHI SEIKI MDV 30 can be programmed to lap and polish wafers from different sizes (up to 8 inch). This tool also ensures minimal peripheral subsurface damage to the wafer. The resulting wafer surfaces are of superior flatness, low surface roughness and extremely accurate tolerance, uniformity and consistency. This machine is ideal for microelectronic components or wafers and is used for research and development, processing, and production of integrated circuits. MDV 30 is also highly reliable and easy to use, making it ideal for industrial applications. The machine is designed with a modular structure, meaning that it can easily be customized and reconfigured to meet the customer's specific needs. This asset also has the ability to connect to other ICHI SEIKI systems, making for a seamless production process.