Used INGOT FCR #9382819 for sale

INGOT FCR is a wafer grinding, lapping, and polishing equipment designed and manufactured by INGOT Systems. The primary purpose of the system is to produce polished, high-precision silicon wafers suitable for use in integrated circuits, semiconductors, MEMS, and other advanced technology products. The unit consists of two modular processing sections, a grinding section and a polishing section. In the grinding section, an abrasive belt is used to grind and shape the edges of a silicon wafer. An adjustable magnetic chuck is used to control the height of the belt, ensuring the wafer is ground uniformly. A water lubrication machine is integrated into the grinding section to reduce friction and carry away debris. In the polishing section, two sets of polishing pads are used to smoothly finish the wafer's surface. A patented retaining plate holds the pads together, providing a uniform finishing surface. The speed and power of the polishing motion can be adjusted using a built-in motor controller. The entire process is automated, allowing FCR to produce high-precision wafers quickly and accurately. The tool is designed to be easy to use and maintain. It has a range of safety features integrated into the design, including light curtains, emergency stops, and power interlocks. INGOT FCR is a reliable, versatile asset designed to meet the specialized needs of high-tech manufacturers. It has been successfully used to process wafers for a variety of products, including solar cells, semiconductors, and MEMS devices. Its simple design and flexible controls make it an ideal choice for engineers and manufacturers looking for fewes cost of ownership, reliable performance, and consistent results.