Used IPEC 472 #293819396 for sale

IPEC 472 wafer grinding, lapping & polishing equipment is a dedicated system for the grinding, lapping and polishing of silicon wafers up to 8.0" diameter. The unit is designed to provide a complete solution for the wafer processing requirements of modern semiconductor production lines. It is comprised of the following components: a grinding/lapping head, a lapping table, a polishing head, and a wafer movement machine. The grinding/lapping head is a two-axis, high-precision, variable-speed spindle with a maximum speed of 4,000 rpm. It is used to grind and lap the wafer to the desired profile. The lapping table is a high-precision, closed loop, servo-controlled table that allows the user to move the wafer in any direction. It also features a variable release tool for uniform lapping pressure. The polishing head is a two-axis, high-precision, variable-speed spindle with a maximum speed of 4,000 rpm. This is used to provide a perfectly flat surface on the wafer. The wafer movement asset is a closed-loop, vacuum-sealed model that provides precise control of the wafer's position. This ensures that the grinding, lapping and polishing processes are handled with great accuracy and repeatability. 472 offers a number of features to enhance its performance and flexibility. These include closed loop consignor-level feedback, real-time process monitoring and localized material transport systems. In short, IPEC 472 wafer grinding, lapping & polishing equipment is an ideal choice for the modern wafer processing requirements of semiconductor production lines. With its high-precision components, closed-loop servo-control and ease of use, it is the perfect solution for time-saving, precise and repeatable processes.