Used IPEC 676 #293648318 for sale

IPEC 676 wafer grinding, lapping, and polishing equipment is an efficient and cost-effective solution for semiconductor manufacturers and other industries that rely on micro-scale surface finishing processes. It is designed specifically for wafer processing and its applications range from CMP (Chemical Mechanical Planarization) processing to backgrind, lapping and polishing operations. Utilizing state-of-the-art servo-driven technology and accurate temperature control, 676 has the capability to precisely process substrates up to 6 inch in diameter. This system is a high-end, advanced machine that will reduce the time and labor required for wafer processing. It is capable of executing various grinding, lapping and polishing operations with high precision and accuracy. It employs sophisticated computer vision and other control systems to optimize the orientation and alignment of the substrate, provide real-time surface quality control and enable calibration of the polishing process. This unit is able to detect surface defects as small as a few nanometers, ensuring repeatable, high quality results. IPEC 676 features a fully automated, modular loading and unloading machine for wafer cassettes and is able to change wafer loading position quickly and accurately in all directions. This tool can accommodate up to 10 wafers with diameters from 4 to 6 inches, and comes with the ability to select from a range of different metal, diamond and cerium oxide abrasives. It is equipped with a high performance closed loop feedback control asset which allows for accurate process setting and control and user friendly HMI for easy operator control. 676 is designed for long-term sustainability and reliability. It is built with a corrosion-resistant base material, precision-made components, and durable seals and hoses to ensure a long model lifetime. With an innovative design and advanced features, IPEC 676 will reduce the overhead and cost of maintaining a clean and safe environment, while ensuring optimal results. With minimal maintenance and up-time, 676 wafer grinding, lapping and polishing equipment is an ideal solution for highly efficient and reliable wafer processing.