Used IPEC / WESTECH / SPEEDFAM 372 #293750640 for sale

IPEC / WESTECH / SPEEDFAM 372 Wafer Grinding, Lapping & Polishing Equipment is a versatile, production-level precision machine designed for processing pre-patterned surfaces and materials. The machine allows for multiple step grinding, lapping, and polishing processes, as well as surface metrology for enhanced performance and quality assurance purposes. The machine is composed of two parts, the Grinding/Lapping head and the Polishing head. The grinding/lapping head uses diamond abrasives to reduce surface roughness and increase planarity on planar surface feature sizes ranging from 0.02 micron to 100 micron. This process is ideal for patterned surfaces with extremely fine features, as the process is more economical and efficient than surface planarization metrology. The polishing head is designed for polishing and scratching resistive surfaces with minimal pressure and offers excellent planarity, edge-to-edge repeatability and uniformity throughout the process. IPEC 372 wafer grinding, lapping and polishing system is completely automated, providing superior precision and repeatability as well as high-level accuracy and cost efficiency. Automation allows the process to run continuously while adjusting parameters to optimize results on both the grinding and polishing stages. This minimizes manual content and decreases the risk of errors. The unit also features high-level programmable features such as dry and slurry grinding, wafer swap, wafer flip, and intermediate cleaning steps. The entire equipment is equipped with temperature and humidity control systems, which are important for quality assurance purposes. It is also equipped with a number of safety features to ensure the safety of operators. WESTECH 372 Wafer Grinding, Lapping & Polishing Machine is also designed to integrate with other equipment, increasing its process flexibility and scalability. 372 Wafer Grinding, Lapping & Polishing Tool offers reliable, high-performance wafer processing for production of high-precision, complex surfaces. The automated process and integrated quality assurance systems ensure a consistent and economical process for extremely fine features and high-level planarity needs of the consumer electronics and semiconductor industries.