Used IPEC / WESTECH / SPEEDFAM 372M #293762027 for sale

IPEC / WESTECH / SPEEDFAM 372M Wafer Grinding, Lapping & Polishing Equipment is a high-performance apparatus designed to precision grind, lap and polish very thin wafers. The equipment utilizes abrasive, lapping, and polishing techniques to produce a highly accurate and uniform surface finish on wafers and other disk-shaped substrates. Its advanced micro-mechanical assemblies enable variable feed and grind/lap/polish settings to meet the most demanding requirements for high-precision, ultra-smooth and uniform surfaces. IPEC 372M has a large work area of over 6 feet in diameter and a top-mounted, double sided swing arm spindle drive that allows for quick, easy and accurate part loading. The performance of the equipment is further enhanced by its temperature controlled operation. There are four separate cooling fans that actively cool the spindle, ensuring the wafer is not exposed to high temperatures during the grinding, lapping and polishing process. The unit also features a high-precision spindle drive system that is built-in, allowing for precisely controlled, high speed feeds and grind/lap/polish settings. WESTECH 372M is equipped with several safety features including safety covers, lighted covers for polishing, low voltage control circuits and electrical operation features. The unit is also designed to protect against excessive force or pressure being applied when handling the wafers. SPEEDFAM 372M also features a dynamic load control that prevents damage to the wafer. Additionally, it is designed to eliminate the hazards associated with an airborne dust and particulate particles. In terms of maintenance, 372M Wafer Grinding, Lapping & Polishing Unit has minimal service requirements. The equipment requires infrequent nighttime, periodic maintenance and can be routinely serviced with no interruption to production. The unit is also easily configured and operated, with few calibration and supply requirements. The entire grinding, lapping and polishing process can be monitored through the controls and indicators located on the machine and can be adjusted quickly with minimal effort. IPEC / WESTECH / SPEEDFAM 372M Wafer Grinding, Lapping & Polishing Tool provides manufacturers, engineering facilities, and laboratories the capability to quickly and accurately process high-precision wafers and other disks-shaped substrates for a wide range of applications. This versatile asset is designed for optimal performance and reliability so that the user can immediately and continuously produce the results needed for their demanding applications.