Used IPEC / WESTECH / SPEEDFAM 372M #9191766 for sale

ID: 9191766
Wafer Size: 8"
STI Oxice CMP system, 8" Currently installed.
IPEC / WESTECH / SPEEDFAM 372M is a powerful wafer grinding, lapping, and polishing system designed for high-throughput and precision applications. It has a robust and reliable design and incorporates several advanced features, such as automatic diamond dressers and automatic process control systems. IPEC 372M machine comes with variable spindle speed and variable diamond wheel rotation, allowing for precise control over wafer grinding and polishing operations. The machine can be operated in either manual or automatic modes, and has an intuitive HMI for easy set-up and operation. The integrated automatic diamond dresser is capable of dressing the grinding wheel whenever necessary. The automatic process control system continually monitors and adjusts the system, enabling precise and consistent results. The wafer grinding head has a maximum feed rate of 2000 mm/min and is designed for grinding thin film layers and surface features with high reproducibility. It has an adjustable stroke limit stop for preventing over- or under-grinding of layers. The integrated wafer polishing head has a maximum polish rate of 4000 mm/min and is ideal for edge rounding and surface finishing. It can also be used for mirror-like polishing on similarly thin layers. In addition to wafer grinding and polishing, WESTECH 372M machine can also be used for lapping operations. It comes with a rotating table and adjustable stops allowing for precision lap depth control, as well as a mechanical drive for high cutting accuracy and repeatability. Due to its robust design and comprehensive features, 372M is capable of withstanding harsh production environments, and is particularly suitable for applications such as semi-conductor manufacture, wafer back grinding, and other high-precision industry operations.
There are no reviews yet