Used IPEC / WESTECH / SPEEDFAM 372M #9191775 for sale

ID: 9191775
Wafer Size: 8"
Oxide CMP system, 8".
IPEC / WESTECH / SPEEDFAM 372M is a wafer grinding, lapping, and polishing equipment that is used in many semiconductor foundries for the manufacturing of wafer lithography masks. This system is designed to provide a high level of accuracy in a cost effective manner. The unit is equipped with a high-precision grinding machine, 20-cycle controllable grinding process, 10-cycle lapping process, and an 8-cycle polishing process. The tool uses touch sensors coupled with a 3D software package, which ensures the accuracy of the grinding by constantly monitoring and controlling the width and position of the grinding area. This allows for the ability to grind wafers to an average roughness value (Ra) as low as 0.25 μm and a maximum surface roughness of 0.2 μm. The grinding process is able to achieve a flatness of within 3 μm for planarization and to achieve the desired surface finish. The grinding wheel used is a composite material with diamond grain particles for maximum sharpness and performance. The asset is also designed for optimal lapping and polishing, allowing it to achieve a maximum wafer thickness uniformity of ±2 μm. The lapping and polishing process uses a controllable wafer oscillation throughout the process to ensure that a uniform finish is achieved. The lapping liquid used is a special high-grade liquid that offers maximum lubricity and performance. The polishing process uses a combination of flat laps and rubber-based lap pads to achieve the desired finish. The model is connected to a PC with a Windows-based operating equipment, which allows for easy operation and maintenance. The system also comes with a variety of sensors and power supplies that can be used to control the unit. This machine also offers the option to use a robotic arm for manufacturing prototyping and small scale production runs. The tool is a cost-effective and efficient solution for wafer grinding, lapping, and polishing applications. Its high-precision grinding and lapping capabilities allow for the successful production of high quality and low-cost microelectronic devices. The low cost and ease of operation make it a great choice for almost any semiconductor foundry.
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