Used IPEC / WESTECH / SPEEDFAM 372M #9191777 for sale

IPEC / WESTECH / SPEEDFAM 372M wafer grinding, lapping and polishing equipment is designed to provide high-precision surface preparation and shaping of semiconductor wafers and other hard, brittle substrates. This system can process substrates up to 8 inches in diameter. IPEC 372M features a wafer transport unit which allows for multiple steps in the grinding, lapping and polishing process to be performed in a single pass. This process is carried out on a 4-axis table mounted above the machine's grinding head. The table features a variable-speed drive that allows for the exacting control of grinding, lapping and polishing speed. These speeds are adjustable from 0.2 to 350 rpm. WESTECH 372M's grinding head consists of an 8 inch diameter rotating table which features four diamond grinding wheels and four adjustable backing plates. This flexible design allows for grinding of any angle, bevel or flat surface on the wafer up to 1 μm in accuracy. The adjustable backing plates also facilitate a repeatable, precise and contamination-free processing environment. 372M offers a variety of lapping and polishing options, as well as multiple media options for different processes. A special polishing wheel is used to achieve superior surface finish, while an innovative head design ensures that the motion of the head is perfectly synchronized with the motion of the table. This both ensures a consistent process and reduces the risk of grinding irregularities. SPEEDFAM 372M wafer grinding, lapping and polishing tool is made of premium quality components for optimal performance and longevity. This asset also offers an ergonomic design which ensures operator safety and comfort. Additionally, this model is fully automated and comes with a three-year warranty for peace of mind. All of these features make IPEC / WESTECH / SPEEDFAM 372M wafer grinding, lapping and polishing equipment the ideal solution for many precision surface preparation and shaping needs.