Used IPEC / WESTECH / SPEEDFAM 372M #9191784 for sale

ID: 9191784
Wafer Size: 8"
STI Oxide CMP system, 8".
IPEC / WESTECH / SPEEDFAM 372M is a multi-functional wafer grinding, lapping and polishing equipment for silicon and other compound semiconductor materials. This system uses advanced microseismic grinding technologies to produce clean and smooth surfaces on silicon wafers up to 12" in diameter. The unit has 3 subsystems- the prober, the grinder, and the lapping/polishing station. The prober can test wafer surface topography and detect anomalies, while being interfaced with a PC and PCI-bus 19" rack-mounted data acquisition hardware. It can transport up to 6 wafers per minute, with a maximum of 94 wafers. It also has 1/2 hp DC motor drive, a 30" X 30" steel NEMA 12 platform equipped with a 4-way manual shift, and 4-axis motion control for rapid and accurate processing of the wafers. The grinder subsystem uses advanced high-speed, high-precision grinders to reduce wafer production time while increasing uniformity and product quality. These grinders use 36 motorized stages over 4 axes, with a 5-axis to 6-axis CNC control machine. It also has a 300mm X 50mm X 35mm Grinding Platform, precision linear bearings, and dual-bearing automation. The accuracy is within 0.1 micron, and the total grinding capacity is 330mm per minute. The lapping/polishing station uses two robotic sub-systems for precision lapping and polishing of the wafers. It also uses warm-water cooling with a submersible heater and a closed-loop flow tool for efficient cooling action. The lapping/polishing station has 6 diamond grinding pre-polish heads, a digital controller, and a selection of grinding and polishing films. The total polishing capacity is 28mm per minute. IPEC 372M is a state-of-the-art machine with superior performance in long run production of highest quality semiconductor wafers. It is an ideal wafer grinding and polishing machine, offering a comprehensive range of services, including precision surface grinding, cutting, and polishing. The machine is designed to provide the highest degree of accuracy and repeatability, to ensure consistent quality and performance in production processes.
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