Used IPEC / WESTECH / SPEEDFAM 372M #9266218 for sale

IPEC / WESTECH / SPEEDFAM 372M is a high-performance wafer grinding, lapping, and polishing equipment designed for combining the functions of the wet process area and the polishing area into a single system. The unit is designed for grinding wafers from silicon to several different thicknesses, followed by lapping and polishing. With its modular components, it offers flexibility for changing wafer sizes in the machine. The tool consists of an automatic loader, which precisely controls the loading of wafers into the grinding tool. A mechanical device known as the spindle is then used to rotate and grind the wafer.The grinding is achieved by the abrasive slurry that is fed into the spindle. The abrasive particles in the slurry then abrade and remove the unwanted material from the wafer. After the grinding process, the lapping procedure follows. This step utilizes a diamond lapping plate that uses a recirculation asset to provide a uniform and controlled lapping action on the wafer. Finally, the polishing process takes place. This is where the surfaces of the wafer are prepared for further handling procedures such as thinning, coating, etc. The wafer grinding, lapping and polishing model is equipped with several safety features. The spindle is protected from accidental overloads or collisions, by a pneumatic cushion on the spindle rotation. There is also a monitored electrical equipment that ensures the correct process parameters are maintained at all times. This ensures the consistent quality of the finished wafers. IPEC 372M system is controlled via a user-friendly interface which allows for easy control of all grinding, lapping and polishing parameters. The unit is also able to monitor the process and craft the results based on the operator's requirements. Furthermore, the machine is capable of handling wafer sizes up to 12-inch in diameter in one operation, with a maximum speed of 40,000 rpm. Overall, WESTECH 372M is an advanced wafer grinding, lapping and polishing tool, designed with the latest technology to offer a high level of accuracy and flexibility for the modern wafer fabrication process. It is a reliable and cost-effective method for obtaining high-performance results with precise finishes.