Used IPEC / WESTECH / SPEEDFAM 472 #25450 for sale

IPEC / WESTECH / SPEEDFAM 472 Wafer Grinding, Lapping & Polishing Equipment is a high-precision automated combination machine tool intended for use in semiconductor, decorative and industrial markets. This IPEC 472 system is an engineered solution incorporating the latest technologies in machine design, motion control and duty cycle automation. This unit features a unique table set up and can handle a wide range of parts with its versatile in-line process control through a user-friendly touch-screen interface. The machine consists of three main components: the Profile Rail, the Grinding Wheel and the Lapping/Polishing Plate. The Profile Rail is designed for up to three wafers at a time and is adjustable for length, width, and thickness of each wafer. The Grinding Wheel is powered by a powerful AC motor and is able to achieve a constant precision over a wide range of speeds. It is also equipped with a self-contained dust collection machine for preventing wafer breakage. The Lapping/Polishing Plate is designed to be easily adjustable for multiple wafer sizes and thicknesses. It is also equipped with an ultra-precise dressing valve for precise, repeatable control over the lapping/polishing process. WESTECH 472 incorporates a closed-loop front loading automation tool, capable of handling multiple-part batches through automated pushback and repackaging stages. It is also able to deburr and profile wafers, remove grinding burrs and lap or polish the surface of wafers. The machine is capable of reaching a grinding accuracy of less than 1um and a lapping/polishing accuracy of less than 0.3um and features sub-micron linear accuracy over extended lengths and with minimum thermal drift. SPEEDFAM 472 can also be adapted with a wide range of changeable fixtures, allowing the user to modify the machine to adapt to their specific requirements. Additionally, the machine is equipped with vibration isolation for ultra-smooth operation, allowing for high production rates with minimum vibration effects on the parts being processed. 472 provides operators with a highly accurate, highly-configurable and secure platform for handling sensitive wafers, with the ability to achieve a high degree of accuracy and repeatability within a set of adjustable parameters. It is also capable of delivering significant cost savings through consistently improved yields and minimized downtime.