Used IPEC / WESTECH / SPEEDFAM 472 #9135545 for sale

IPEC / WESTECH / SPEEDFAM 472 is a wafer grinding, lapping & polishing equipment designed for the ultra-precision processing of semiconductor, optical and electronic substrates. It is based on the advanced technology of a high-speed spindle equipped with diamond abrasives. The system is equipped with multi-axis motion controllers which allow precise manipulation of the wafer during the machining process. IPEC 472 features up to 4 grinding and lapping heads mounted on a rigid tool carrier and is capable of producing ultra-smooth surfaces with minimal bonding surface defects. Its high-speed rotation speeds up the machining process and allows for a high throughput rate. The spindle is capable of speeds ranging from 6,000 RPM to 13,500 RPM. The carrier can be modified to support a wide variety of substrates including semiconductors, optical or electronic devices. The unit is automated and equipped with programmable functions such as auto-alignment, auto-leveling, auto-depth of cut, variable pressure and variable spindle speed. It has an intuitive user interface that allows for easy setup and programming of the machine. The tool also has a multi-level wafer protection asset that keeps polishing and grinding debris away from the substrate during processing. This reduces chances of damaging the substrate during machining. WESTECH 472 is also highly precise and accurate with its X,Y linear motion resolution down to 0.00004 inch and its Z-axis repeatability down to +/- 0.0002 inch. The accuracy of the model ensures consistent rotor speed control and substrate positioning during the machining process. 472 has a user-friendly PC-based software equipment with graphical control and graphical feedback that provide data on machining operations. The software offers customization options as well as an effective system for machining parameter control. Overall, SPEEDFAM 472 is an advanced wafer grinding, lapping & polishing unit that is designed to improve the surface integrity and accuracy of semiconductor, optical and electronic substrates. This machine offers superior performance, accuracy and flexibility and is suitable for a wide variety of manufacturing applications.