Used IPEC / WESTECH / SPEEDFAM 472 #9203957 for sale

IPEC / WESTECH / SPEEDFAM 472 Wafer Grinding, Lapping & Polishing Equipment is a versatile tool for the production of advanced substrates. With a modular design, this machine can be customized to meet a wide range of process requirements. IPEC 472 features a high-precision and adjustable working table, a powerful grinding/lapping/polishing spindle, a precise air bearing, symmetrical and rigid supports for controlling movements, and power-controlled feed rates with automatic height adjustment. The spindle in WESTECH 472 is powered by a high-speed brushless DC motor. It's designed to minimize chatter and vibration, and enables higher speeds with consistent torque. The linear bearing is extremely precise, allowing the machine to achieve a very high level of accuracy. The spindle axis is supported on both sides by air bearings, which provide precise and accurate positioning of the spindle. 472 uses an advanced programmable logic controller (PLC) to control the automatic feed rate and the height adjustment system. This allows the machine to make creative use of multiple axes and precise movements. Additionally, a heater-controlled curing oven is used to thermally bond the substrates to the workpiece before grinding, lapping or polishing. SPEEDFAM 472 also utilizes a state-of-the-art cooled media for lapping and polishing wafers. It's equipped with a single-axis media transportation unit, which transfers the media to various abrasive conditions or diamond lapping. With the ability to deliver the correct amount of power for the various processes, IPEC / WESTECH / SPEEDFAM 472 effectively reduces vibration and maintains uniform pressure while polishing. To ensure reliable operation of IPEC 472 Wafer Grinding, Lapping & Polishing Machine, maintenance of the machine is essential. After everday usage, all components should be thoroughly cleaned and inspected for damage and evidence of improper use. Additionally, periodic maintenance is required to make sure that the machine is running at peak efficiency. Proper lubrication and the replacement of worn components and spindle bearings can minimize machine downtime and further prolong its life. In conclusion, WESTECH 472 Wafer Grinding, Lapping & Polishing Tool is a high-performance machine for fabricating advanced substrate materials. With features such as a powerful spindle, advanced PLC control, and efficient media transport, it's designed to meet the needs of the most demanding processes. With the proper maintenance, 472 can run consistently with reliable results.