Used IPEC / WESTECH / SPEEDFAM 472 #9216748 for sale

IPEC / WESTECH / SPEEDFAM 472 wafer grinding, lapping and polishing equipment is an industrial-grade automated wafer finishing system designed for high-volume production. The machine utilizes advanced Siemens Sinumerik 802D CNC controls and a 60kW grinding spindle motor with two-axis simultaneous operation. This high-quality, industrial-grade unit is capable of processing wafers as small as 300 microns and a maximum diameter of 200mm (8 inches). The grinding, lapping, and polishing process is both precise and efficient, thanks to an advanced precision grinding head featuring 3-axis swiveling action. This head is capable of single-point diamond grinding, which creates perfectly flat, smooth surfaces. The two-axis simultaneous operation ensures precision surface generation by eliminating overlap and providing rpm regulation of the grinding head for each axis. The machine also features a polishing head with a pressure regulator for effective material removal with low grinding forces. This pressure regulator allows for low contact pressures to achieve optimum material removal, and the built-in accelerometer automatically adjusts the pressure to the size of the wafer to maximize tool life. The integrated LSI error detection tool monitors all sensors and actuators to ensure proper operation and minimize downtime. A vacuum- and pressure-controlled conveyor asset is included for manual feed and automatic wafer handling. Also included is a tool changer and tool storage for increasing uptime between grinding processes. The machine is enclosed in a sealed environment designed to protect the processed wafer from environmental contamination. A filtration model includes a HEPA filter and an air humidifier to keep the air clean inside the equipment and provide stable humidity levels. Overall, IPEC 472 wafer grinding, lapping and polishing system is an industrial-grade advanced unit for high-volume production. It is equipped with advanced CNC controls, machine heads and various sensors, and includes a pressure regulator, LSI error detector, tool storage, air filtration machine, and an enclosed cleaning environment, all of which makes the tool ideal for large-scale wafer finishing applications.