Used IPEC / WESTECH / SPEEDFAM 472 #9218386 for sale

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ID: 9218386
Wafer Size: 8"
Vintage: 1998
CMP Polisher, 8" Single head 1998 vintage.
IPEC / WESTECH / SPEEDFAM 472 is an excellent equipment for grinding, lapping and polishing wafers. This system utilizes an integrated stepper motor to drive the unit's drive shaft which is connected to three pairs of grinding, lapping and polishing disks. This machine is capable of accommodating wafers up to 6 inches in diameter and 0.5 inch in thickness. The grinding disks are designed to provide a high quality, consistent surface finish for wafers and are available in either 400 or 800 grits. Each pair of grinding disk can be adjusted for diameter and pressure providing maximum flexibility in grinding and polishing operations. Additionally, the disks can be replaced if necessary. The lapping disks are designed for flatness improvement and wafer planarity. This tool adopts a variable speed design which allows adjusting the speed rate to suit the grindings and the lapping operations. The lapping disks can also be adjusted from step to step to achieve the highest accuracy in wafer lapping. The polishing disks of this asset are designed to provide a mirror finish on wafers. The polishing disks are also adjustable, which allows for a higher degree of accuracy and a finer polish. Moreover, a unique platen design is included which ensures that no uneven loads are placed on the polishing disks during operation. IPEC 472 is designed to provide an efficient process that produces a high quality wafer surface finish. This model also includes a safety microswitch and a low voltage power source. Furthermore, its CE compliance guarantees a safe operation in different environments. Overall, WESTECH 472 is an excellent equipment for grinding, lapping and polishing wafers. This system is accurate, reliable and safe with features like adjustable grinding and polishing disks, a microswitch for safety and a wide range of rpm for flexibility. Therefore, this unit is capable of producing a premium wafer surface finish that meets the demands of today's semiconductor industry.
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