Used IPEC / WESTECH / SPEEDFAM 472 #9224973 for sale

IPEC / WESTECH / SPEEDFAM 472 wafer grinding, lapping & polishing equipment is designed for efficient resempling of up to 8 inch (200 mm) wafers. This high-performance, automated system is a reliable and repeatable solution for ultra-precision grinding, lapping, and polishing. IPEC 472 provides high degree of uniformity and high perpendicularity capability. The machine comes with a 4-station carousel which can load up to 4 wafers at a time. Each station includes an independent motorized lapping/polishing head, and two X/Y blades for grinding and cutting. The machine can handle all types of materials such as III-V semiconductors, SiC, soft metals, sapphire, spin-on glass and quartz. The user can set parameters according to the process requirements to provide accurate and consistent precision grinding and polishing processes. The unit is integrated with a user friendly and intuitive graphical user interface (GUI) with automated recipes and process programs, providing features such as auto stop, auto repeat and auto feed emergency shutdown. Robust safety features and advanced robotic technology provide exceptional reliability and improved repeatability with minimized operator involved time. WESTECH 472 also includes a high-resonance driving machine that is capable of achieving high grinding speeds and resolutions while eliminating thermal loads during use. A highly efficient vacuum tool ensures efficient collection of wafers and lapping/polishing solutions, while a integrated filtration asset ensures a clean work environment with no airborne contaminants. SPEEDFAM 472 also comes with an adjustable wafer holder and chuck designed for rapid loading and unloading of up to 8" wafers. The holder is engineered for large, heavy wafers, and is mechanically clamped for a secure hold. Additionally, the user can program and control the tool through IPEC resource center software suite. This suite provides comprehensive process monitoring, statistical process control tools, rapid process optimization and data management. 472 wafer grinding, lapping & polishing model is an optimized solution that provides the highest level of productivity with excellent precision at an economical cost. With its precise, accurate, and consistent results, it is widely used in the semiconductor and electronic component industries.