Used IPEC / WESTECH / SPEEDFAM 472 #9259783 for sale

IPEC / WESTECH / SPEEDFAM 472
ID: 9259783
Vintage: 1996
Automatic wafer polisher 1996 vintage.
IPEC / WESTECH / SPEEDFAM 472 is a wafer grinding, lapping and polishing equipment designed to produce high precision, high quality wafers. The system utilizes an advanced airflow design to control dust and airborne particles during processing, and features several unit enhancements for improved wafer integrity and repeatability. The main feature of the machine is a high-precision rotational spindle which is designed to produce high quality wafers with extremely small feature sizes. This spindle offers an exceptionally high degree of precision, with controllable angular accelerations of up to 100 revs/second, and a maximum spindle RPM of 2000. The tool is also equipped with an advanced set of sensors to ensure accurate readings of the surface finish and shape of the wafers, ensuring repeatability and accuracy. The asset has two transport stages, which are designed to move the wafer from the loading station to the grinding/lapping/polishing heads. The first stage utilizes a vacuum to lift and move the wafer, while the second stage utilizes an advanced air suspension model to transfer the wafer from station to station. This equipment eliminates vibration and air turbulence, resulting in a smoother finish with less wafer damage. Also included on the system is an optional cooling unit which can be used to maintain a consistent temperature at each station during the grinding/lapping/polishing process. This prevents thermal effects from occurring, and helps ensure that the wafers are consistently processed at the same temperature. Finally, the machine is controlled by an advanced interface which offers real-time data analysis, process parameters control, and process history management. This ensures improved process accuracy, repeatability, and traceability, all of which are essential for high-precision wafer processing. In conclusion, IPEC 472 is an advanced wafer grinding, lapping and polishing tool specifically designed to produce high precision, high quality wafers. It's unique designs, advanced features and asset enhancements ensure a consistently accurate, repeatable and traceable process, all of which are essential for the production of high precision wafers.
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